(1) Range of Thermal Conductivity and Stability Heat-conducting PET Film Silicone film is highly selective in terms of thermal conductivity and can be from 0.8w / k.m ---- 3.0w / k.m or more with stable performance and long-term reliability. At present, the maximum thermal conductivity of the double-sided adhesive tape does not exceed 1.0w / km, and the thermal conductivity is not satisfactory. The thermal grease is a normal-temperature curing process, which is easy to produce surface cracks under high temperature, unstable performance, easy volatilization and flow and thermal conductivity Gradual decline is not conducive to long-term reliable system operation.
(2) The structure of the poor process to bridge the heat sink and cooling components to reduce the technical requirements Poor thermal conductivity of the silicone film thickness PET film, the hardness can be adjusted according to different design, so in the thermal channel can be bridged cooling structure , Chips and other dimensional differences, reducing the structural design of the heat sink contact surface requirements of poor, especially for flatness, roughness of the poor, if you improve the processing accuracy will greatly improve the product cost, so Heat-conducting PET film Silicone film can fully increase the heating element and the contact area of the heat sink, reducing the production cost of the heat sink. In addition to the traditional PC industry, now the new cooling solution is to remove the traditional radiator, the structural components and radiators unified into the cooling structure. In the layout of the PCB layout of the heat sink on the back of the chip, or layout in the front, you need to heat the chip around the cooling holes, the heat through the copper foil and so on to the back of the PCB, and then through the thermal plastic sheet filled with silica gel thermal conductivity guide Cooling structures (metal brackets, metal housings) to the underside or side of the PCB optimize the overall thermal architecture while also reducing the cost of the overall thermal solution.
(3) EMC, Insulation Performance Thermally conductive PET film Silicone sheets have excellent thermal and dielectric properties due to their inherent material properties. They are highly resistant to EMC and are not easily pierced and crushed or damaged under pressure due to the silicone material , EMC reliability is better. Due to the characteristics of the material itself, thermal double-sided tape has low EMC protection performance, often failing to meet customers' requirements and is limited in use. Generally, only the chip itself is insulated or the surface of the chip is EMC-protected When you can use. Thermal grease due to the material properties of its own EMC protection performance is relatively low, often fail to meet customer needs, more limited in use, generally only the chip itself has done the insulation or the chip surface EMC protection can be used.
(4) the effect of shock absorption and sound absorption Thermal conductivity of the silicone film silica gel film carrier will have a good flexibility and compression ratio, which has a good damping effect, and then adjust the density and hardness can produce low-frequency electromagnetic noise played Very good absorption. Thermal adhesive double-sided adhesive bonding mode determines that it does not have shock absorption effect. The use of thermal grease hard touch determines that it does not have shock absorption effect.
(5) installation, testing, reusability and ease of thermal conductivity of PET film Silicone film for the stability of the solid, was plastic strength optional, easy to disassemble; flexible response, reusable. Thermal double-sided adhesive once used, not easy to disassemble, there is the risk of damage to the chip and the surrounding devices, not easy to disassemble thoroughly. In the scraping thoroughly, it will scratch the surface of the chip and wipe dust, grease and other interference factors, is not conducive to thermal conductivity and reliable protection. Thermal grease can not be disassembled, must be carefully swabbed, it is not easy to wipe thoroughly, especially in the replacement of thermal conductivity test, will have an impact on the reliability of test data, thus affecting the engineer's judgment.